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导航

邹嘉佳，高宏，周金文

Performance Study of a Novel Silver-filled Conductive Adhesive Used for Die Bonding

ZOU Jiajia, GAO Hong, ZHOU Jinwen

电子与封装 . 2016, (4): 1 -3 . DOI: 10.16257/j.cnki.1681-1070.2016.0039