湿度传感元件制备、封装及检测电路设计的研究进展*
丁书聪,黄宜明,王晓,梁峻阁,顾晓峰
Research Progress of Humidity-Sensing ElementPreparation, Packaging, and Detection-Circuit Design
DING Shucong, HUANG Yiming, WANG Xiao, LIANG Junge, GU Xiaofeng
电子与封装
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2021, (1): 10203
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DOI: 10.16257/j.cnki.1681-1070.2021.0104
