60 mm尺度CMOS图像传感器装片工艺技术研究

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蒋玉齐;肖汉武;杨婷

Die AttachEvaluation for Supper Large CMOS Image Sensor Chip above 60 mm

JIANG Yuqi, XIAO Hanwu, YANG Ting

电子与封装 . 2021, (4): 40202 . DOI: 10.16257/j.cnki.1681-1070.2021.0404