关键词: 封装技术, 厚膜混合集成电路, 国产裸芯片, 吸嘴, 有限元仿真

Abstract: Chip mounting is a key link in the packaging process of microelectronic component, and the reliability of the chip after mounting has an important impact on the overall performance and quality of the circuit. An automatic chip loading nozzle for thick-film hybrid integrated circuits is introduced, which is based on the IP-500 automatic chip loading machine and is developed for the characteristics of thick-film hybrid integrated circuits and domestic bare chips. Starting from the structure and material of the automatic chip loading nozzle, the finite element simulation software is used to calculate the pressure and focus on the stress distribution of the nozzle and the chip. The results show that the optimized rubber nozzle can effectively solve the problem of damage occurring in the automatic chip loading process of domestic bare chips.

Key words: packaging technology, thick-film hybrid integrated circuit, domestic bare chip, nozzle, finite element simulation