关键词: 硅基射频微系统, 热-力耦合, 有限元仿真, 三维异构集成

Abstract: As the core component of information transmission and reception, radio-frequency system plays an important role in the precise transmission of information. With the trend of electronic devices towards miniaturization, high-density integration and high power density, radio-frequency microsystems have become mainstream products with their advantages of high performance, high reliability and low cost. Due to the small size and high power density of radio-frequency microsystems, the heat dissipation problem during the working process is becoming more and more prominent, which will have an impact on their reliability. Therefore, the reliability of microsystems under operation needs to be simulated by means of finite element method to optimize the product performance. A radio-frequency microsystem is developed through three-dimensional heterogeneous integration method, and its the heat transfer and thermal-force coupling characteristics are analyzed by means of finite element simulation to prejudge the thermal and mechanical characteristics of the radio-frequency microsystem under operation, which effectively avoids the design risk and provides support for the high reliability of the radio-frequency microsystem.

Key words: silicon-based radio-frequency microsystems, thermal-force coupling, finite element simulation, three-dimensional heterogeneous integration