关键词: 封装技术, 电镀金液, 工艺参数, 超声波键合, 力学性能

Abstract: Ultrasonic bonding is used to carry out gold wire bonding test on materials prepared from cyanide-free gold electroplating and cyanide-containing gold electroplating for chip packaging, and the influence of bonding process parameters (ultrasonic power, ultrasonic time, bonding pressure) on the bonding performance is studied. The results show that the substrates with cyanide-free gold electroplating solution have higher hardness and more failures occur at the gold wire soldering balls, while the substrates with cyanide-containing gold electroplating solution have lower hardness and less failures occur at the gold wire soldering balls. For low hardness electroplating gold, the soldering ball diameter and bonding height are lower, which helps to achieve better fusion between the bonding gold wire and the electroplating gold interface. The ultrasonic time is the main factor affecting the bonding performance. When the ultrasonic time is increased to 300 ms, the gold wire soldering balls no longer fail, which effectively solves the problem of poor bonding performance.

Key words: packaging technology, gold electroplating solution, process parameter, ultrasonic bonding, mechanical property