电子与封装 ›› 2025, Vol. 25 ›› Issue (10): 100601 . doi: 10.16257/j.cnki.1681-1070.2025.0175

• 封装前沿报道 • 上一篇    

大孔径高深径比玻璃通孔的高效高质超级填充

吴恒旭   

Efficient and High-Quality Super-Filling of Through Glass Vias with Large Aperture and High Aspect Ratio

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