关键词: 玻璃基板, 传输线, 特征阻抗, TDR, 插入损耗

Abstract: The glass interposer with excellent electrical performance is one of the key technologies of high speed and high density package in the future.In this paper,with measurement and simulation methods,the influence of changes in size of RDL transmission line on characteristic impedance was researched,which provides a reference for designing impedance control RDL transmission lines on glass substrate,and the high frequency loss of trans mission line song lass and silicon substrate was tested.The results show that insertion loss of the RDL transmission line on glass substrate is about-0.2 dB/mm at 40 GHz,which is far greater than that on silicon substrate,so the RDL transmission line on glass substrate is more suitable for high frequency and high speed products.Measurement and simulation results are in good agreement.

Key words: glass substrate, trans mission line, characteristic impedance, TDR, insertion loss