关键词: 薄膜工艺, 再布线层, 可组装性

Abstract: With the development of military equipment in the direction of intelligence and miniaturization, higher requirements have been put forward for integrated packaging technology.High density thin film rerouting technology based on ceramic substrates can be applied to thin-film multi-chip module-ceramic/deposition (MCM-C/D) package structures to realize miniaturized integration of sensing systems, computing systems, and testing systems.High density carrier board samples based on high-temperature co-fired ceramics with two-layer metal two-layer dielectric (HTCC-2M2P) structure with wiring density ≤40 μm/40 μm are prepared, and the assemblability of the rerouting layer meets the technical requirements for soldering and lead bonding in accordance with the GJB548 standard after the environmental assessment such as high temperature storage and temperature cycling.

Key words: thin film technology, rerouting layer, assemblyability