电子与封装
• 封装、组装与测试 • 下一篇
陈莹，成燕燕，王波，李祝安
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CHEN Ying, CHEN Yanyan, WANG Bo, LI Zhu’an
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摘要：
随着集成电路不断向小尺寸、高速率的方向发展，陶瓷管壳的应用频段要求逐渐增高。本文设计了一款方形扁平无引脚封装（QFN）陶瓷管壳。通过对其键合指和腔体的参数化设计确定设计方案，利用测试板和陶瓷50 Ω传输线搭建完整测试链路。结果显示，设计的QFN48管壳组成的全链路可覆盖0~5 GHz高速传输。
关键词: 方形扁平无引脚封装, 管壳设计, 全链路
Abstract: With the continuous development of integrated circuits towards small size and high speed, the applicable frequency band requirements for ceramic tube shells are gradually increasing. A high-frequency ceramic tube shell with quad flat no-leads package (QFN) has been designed. The design scheme is determined through parameterized deign of its bonding fingers and cavity. A complete testing link is built using a test board and a ceramic 50 Ω transmission line. The final test result shows that the entire test link composed of the ceramic tube shell designed in this paper can cover high-speed transmission from 0-5 GHz.
Key words: quad flat no-leads package, shell and tube design, entire link
陈莹, 成燕燕, 王波, 李祝安. 一款高频QFN48陶瓷管壳的设计[J]. 电子与封装, doi: 10.16257/j.cnki.1681-1070.2025.0064.
CHEN Ying, CHEN Yanyan, WANG Bo, LI Zhu’an. Design of a High-Frequency QFN48 Ceramic Tube Shell[J]. Electronics & Packaging, doi: 10.16257/j.cnki.1681-1070.2025.0064.
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链接本文: https://ep.org.cn/CN/10.16257/j.cnki.1681-1070.2025.0064
