关键词: 光电共封装, 光学相控阵, 集成光波导, 先进封装

Abstract: Co-packaged optics (CPO) technology adopts advanced packaging technology to heterogeneously integrate electronic integrated circuits and photonic integrated circuits into the same package, which has the advantages of high compactness, low power consumption, and large capacity. This technology is considered a key direction for the next generation of optoelectronic technology and provides an effective implementation approach for high-performance optical phased array (OPA) based on integrated optical waveguide. An overview of the latest research progress on three typical CPO technologies was summarized, the advantages and problems faced by the application of CPO technology in each OPA were discussed. Finally, the challenges faced by the widespread application and industrialization of CPO technology in high-performance OPA based on integrated optical waveguide were discussed from the aspects of high-density packaging, efficient heat dissipation, and electronic-photonic co-simulation.

Key words: co-packaged optics, optical phased array, integrated optical waveguide, advanced packaging