关键词: 面板级先进封装, 物理气相沉积, 金属种子层沉积, 铜互连工艺

Abstract: As one of the key process equipment for panel-level advanced packaging, the performance of the PVD sputtering system directly affects packaging quality and reliability. This paper introduces a sputtering system designed for large-size (510 mm × 515 mm and above) panel-level advanced packaging. The system is equipped with multiple modular units, which reduce process costs while enabling continuous and automated sputtering deposition. The self-developed large-size cathode sputtering system significantly improves the deposition rate and increases target utilization to over 50%. Additionally, the self-developed cooling system effectively reduces substrate surface temperature, mitigates warpage, and achieves finer process control. Furthermore, the non-uniformity of Ti and Cu film deposition on 510 mm × 515 mm substrates is measured at ±3.05% and ±2.36%, respectively. The adhesion strength of Ti/Cu films on glass substrates reaches 277 N/cm², reducing risks such as seed layer delamination. The entire process is completed within a vacuum system, minimizing contamination from moisture and particles. The findings of this study provide valuable insights and guidance for the advancement of panel-level advanced packaging technologies.

Key words: panel level package, physical vapor deposition, seed layer, copper interconnection, technology