中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装

• 材料、器件与工艺 •    下一篇

无衬底Micro LED芯片直显研究进展

梁劲豪,余亮,陈勇林,屠孟龙   

  1. 深圳雷曼光电科技股份有限公司,广东 深圳  518000
  • 收稿日期:2025-08-15 修回日期:2025-09-25 出版日期:2025-09-29 发布日期:2025-09-29
  • 通讯作者: 屠孟龙
  • 基金资助:
    深圳市科技计划项目(KJZD20230923114208016)

Research Progress on Substrate-less Micro LED Chips for Direct Display#br#

LIANG jinhao, YU Liang, CHEN Yonglin, TU Menglong   

  1. Ledman Optoelectronic Co., Ltd., Shenzhen 518000, China
  • Received:2025-08-15 Revised:2025-09-25 Online:2025-09-29 Published:2025-09-29

摘要: Micro LED技术具有众多优势,如高亮度、高对比度、高分辨率、低功耗以及长寿命等。随着芯片尺寸逐渐减小,无衬底Micro LED芯片应用研究越来越迫切,无衬底Micro LED芯片微小的尺寸,屏体发光面积占比不足1%,显著提升对比度。本文简要对比了Micro LED在PM玻璃基板上的应用以及AM玻璃基板上的应用。其中PM驱动玻璃基板线宽线距最小可达12 μm(传统PCB基板极限为50 μm),适配更小芯片尺寸。结合巨量通孔技术和厚铜技术能实现成本与显示效果的平衡。同时针对玻璃基板所存在的强度以及可靠性进行相对应的方案设计并实现预期目标。与之相对的AM驱动LED显示屏采用全倒装高压μA级晶片,使用电压为12 V的开关电源,通过高电压、低电流驱动模式,显著降低电流密度,同时AM驱动的像素级精准调控支持任意区域独立升压,可实现局部峰值亮度显示。PM驱动玻璃基板和AM驱动玻璃基板分别使用无衬底Micro LED芯片在直显方面的应用技术,推动显示技术向超高清、低功耗方向迭代。

关键词: 无衬底Micro LED芯片, 直显, PM玻璃基板, AM玻璃基板

Abstract: Micro LED technology offers numerous advantages, such as high brightness, high contrast ratio, high resolution, low power consumption, and long lifespan. As chip sizes continue to decrease, research into the application of substrate-free Micro LED chips is becoming increasingly urgent. These substrate-free Micro LED chips have extremely small dimensions, resulting in a light-emitting area ratio of the screen of less than 1%, which significantly enhances the contrast ratio. This paper presents a comparsion of the application of Micro LED on PM (passive matrix) driving glass substrates and AM (Active Matrix) driving glass substrates. PM driving glass substrates can achieve a minimum line width/spacing of 12 μm (compared to the 50 μm limit of traditional PCB substrates), making them suitable for even smaller chip sizes. By integrating massive TGV (through glass via) and thick-copper technologies, a cost-performance balance can be achieved without compromising display quality. Meanwhile, targeted design solutions are implemented to address the strength and reliability of glass substrates. AM driven LED displays utilize fully flip-chip high-voltage μA-level chips. Driven by a 12 V switching power supply, this high-voltage, low-current driving mode significantly reduces current density. Simultaneously, the pixel-level precise control enabled by AM driving supports independent voltage boosting in any arbitrary area, allowing for localized peak brightness display. The application technologies of PM driving glass substrates and AM driving glass substrates, both utilizing substrate-free Micro LED chips for direct-view displays, are driving the evolution of display technology towards ultra-high definition and lower power consumption.

Key words:

substrate-free Micro LED chip,  , direct-view display,  , PM-driven glass substrates, AM-driven glass substrates