半导体晶圆键合力控制技术的研究进展与挑战

doi:10.16257/j.cnki.1681-1070.2026.0039

电子与封装

• 封装、组装与测试 • 下一篇

半导体晶圆键合力控制技术的研究进展与挑战

张慧¹，郑志伟²，张辉³，王成君^3,4

1. 南京林业大学机械电子工程学院，南京 210037；2. 南京汇智工业设计有限公司，南京 211153；3. 东南大学机械工程学院，南京 211189；4. 中国电子科技集团公司第二研究所，太原 030024

收稿日期:2025-10-09 修回日期:2025-11-03 出版日期:2025-12-05 发布日期:2025-12-05
通讯作者: 张慧
基金资助:
国家重点研发计划项目（2022YFB3404300）；国家自然科学青年基金（52405304）；智能机器人湖北省重点实验室基金（HBIR202303）

Research Progress and Challenges of the Force Control Technology in Semiconductor Wafer Bonding

ZHANG Hui¹, ZHENG Zhiwei², ZHANG Hui³, WANG Chengjun^3,4

1. School of Mechatronic Engineering, Nanjing Forestry University, Nanjing 210037, China; 2. Nanjing Huizhi Industrial Design Co., Ltd., Nanjing 211153, China; 3. School of Mechanical Engineering, Southeast University, Nanjing 211189, China; 4. The 2nd Research Institute of CETC, Taiyuan 030024, China

Received:2025-10-09 Revised:2025-11-03 Online:2025-12-05 Published:2025-12-05

摘要/Abstract

摘要： 综述了半导体晶圆键合力控制技术的研究现状与发展趋势。首先介绍了晶圆键合的基本原理和分类，分析了键合力在晶圆键合过程中的关键作用。随后详细阐述了影响键合力的主要因素，包括表面形貌、清洁度、化学处理、温度与压力参数等。重点探讨了直接键合、阳极键合、黏合剂键合等典型键合技术的力学控制方法，并介绍了界面表征与键合力测量的关键技术。进一步分析了晶圆键合力控制面临的挑战，提出了未来发展方向，为半导体制造领域的键合工艺优化提供参考。

关键词: 半导体制造, 晶圆键合, 键合力控制, 工艺优化

Abstract: This paper reviews the research status and development trend of the force control technology in semiconductor wafer bonding. Firstly, the basic principle and classification of wafer bonding are introduced, and the key role of bonding force is analyzed. Subsequently, the main factors influencing the bonding force are elaborated in detail, including the parameters of surface morphology, cleanliness, chemical treatment, temperature, and pressure, etc. The mechanical control methods of typical bonding techniques are mainly discussed, such as direct bonding, anodic bonding, and adhesive bonding. The key technologies of interface characterization and bonding force measurement are also displayed. The force‒control challenges of wafer bonding are further analyzed, and the development directions are proposed. The research will provide a reference for the optimization of bonding processes in semiconductor manufacturing field.

Key words: semiconductor manufacturing, wafer bonding, bonding force control, process optimization

张慧1, 郑志伟2, 张辉3, 王成君3, 4. 半导体晶圆键合力控制技术的研究进展与挑战[J]. 电子与封装, doi: 10.16257/j.cnki.1681-1070.2026.0039.

ZHANG Hui1, ZHENG Zhiwei2, ZHANG Hui3, WANG Chengjun3, 4. Research Progress and Challenges of the Force Control Technology in Semiconductor Wafer Bonding[J]. Electronics & Packaging, doi: 10.16257/j.cnki.1681-1070.2026.0039.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

半导体晶圆键合力控制技术的研究进展与挑战

Research Progress and Challenges of the Force Control Technology in Semiconductor Wafer Bonding

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 0

编辑推荐

Metrics

本文评价