中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装

• 封装、组装与测试 •    下一篇

可润湿侧翼QFN毛刺缺陷分析及解决措施

张月升,陈畅,俞开源   

  1. 江苏长电科技股份有限公司,江苏 无锡  214437
  • 收稿日期:2025-12-10 修回日期:2026-01-27 出版日期:2026-02-02 发布日期:2026-02-02
  • 通讯作者: 陈畅

Wettable Flank QFN Burr Defect Analysis and Solutions

ZHANG Yuesheng, CHEN Chang, YU Kaiyuan   

  1. JCET Group Co., Ltd., Wuxi 214437, China
  • Received:2025-12-10 Revised:2026-01-27 Online:2026-02-02 Published:2026-02-02

摘要: 针对可润湿侧翼(WF)方形扁平无引脚(QFN)封装在切割工序中出现的毛刺缺陷进行了研究。缺陷分析发现,一次切割后铜框架残留的难以去除的铜毛刺、铜屑,在电镀过程中被锡层包裹,导致框架连筋(Dambar)宽度增大并超过设计值,二次切割时被刀片挤压易产生锡毛刺。采用实验设计(DOE)的方法,优化了切割作业参数;结合实际作业结果,对切割刀片和框架进行设计改良。结果表明,当切割深度较小、切割刀片自锐性高且Dambar宽度较小时,WFQFN产品良率显著提高,有效改善了可润湿侧翼易产生毛刺的问题。

关键词: 可润湿侧翼, 试验设计法, 切割深度, 框架设计

Abstract: This study investigates burr defects formed during the singulation of wettable flank (WF) quad flat no-lead (QFN) packages. Defect analysis indicated that copper burrs and filings generated in the first singulation were difficult to eliminate. During subsequent plating, these residues were encapsulated within the tin layer, leading to an increase in Dambar width beyond design specifications. In the second singulation step, blade compression readily induced tin burrs. The singulation parameters were optimized using a design of experiment (DOE) approach. Furthermore, the cutting blade and frame design were improved based on experimental findings. The results demonstrated that a reduced cutting depth, a self-sharpening blade, and a narrower Dambar width collectively enhanced the WFQFN product yield and effectively mitigated burr formation on the wettable flank structure.

Key words: wettable flank, doe, cut depth, lead frame design