关键词: 线阵探测器, 倒装互连, 低串扰

Abstract: To achieve higher resolution and faster scanning in single-photon detection imaging, detectors are evolving toward large-scale, highly integrated arrays. To meet the reliability requirements of silicon carbide detectors in linear array applications, a low-crosstalk interconnection process suitable for high-pixel linear detector arrays and readout integrated circuits was developed. A 50-μm-thick stainless steel hard mask fabricated by laser processing was employed, along with a Ti/Ni/Au layer deposited on the bonding pads of the finished circuit chip via a temporary bonding process, effectively mitigating the issues of low bonding strength and insufficient bonding caused by poor wettability between chip aluminum pads and In bumps. Process parameters such as bonding pressure and temperature–time profile were optimized, and adaptive leveling using a hemispherical nozzle was implemented to eliminate insufficient bonding and short circuits caused by non-uniform bonding. Additionally, finite element simulation was used to analyze and design the interconnection crosstalk, achieving a linear array scale of 1×256 with a crosstalk signal amplitude as low as below 0.1% of the input signal amplitude.

Key words: linear array detectors, flip-chip interconnection, low-crosstalk