中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装

• 材料、器件与工艺 •    下一篇

一种2 000 V级30 kA/cm2的高脉冲电流密度绝缘栅触发晶闸管

王坤,宛庆博,邢鹏程,陈万军   

  1. 电子科技大学电子薄膜与集成器件国家重点实验室,成都  610054
  • 收稿日期:2026-03-18 修回日期:2026-04-17 出版日期:2026-04-20 发布日期:2026-04-20
  • 通讯作者: 陈万军
  • 基金资助:
    国家自然科学基金(62334003)

2 000 V-Class 30 kA/cm² Insulated-Gate Trigger Thyristor with High Pulse Current Density

WANG Kun, WAN Qingbo, XING Pengcheng, CHEN Wanjun   

  1. State Key Laboratory of Electronic Thin Film and Integrated Device, University of Electronic Science and Technology of China, Chengdu 610054, China
  • Received:2026-03-18 Revised:2026-04-17 Online:2026-04-20 Published:2026-04-20

摘要: 绝缘栅触发晶闸管(IGTT)凭借驱动简单、过流能力强以及高电流上升速率等优势,目前已作为全电子引信技术中的核心脉冲开关器件,广泛应用于引信爆炸箔起爆。为保证可靠起爆,需提高开关器件的工作电压。然而,随着工作电压的提升,结终端尺寸增大导致芯片有源区面积缩小,从而限制了器件向高脉冲电流密度方向的发展。通过改良场限环工艺并借助Medici TCAD仿真工具,对2 000 V IGTT器件的结终端结构进行优化设计,同时优化元胞结构并改进背面工艺,实现一种具有高耐压等级和高脉冲电流密度的IGTT器件结构。实验结果表明,在同为2 000 V级耐压能力条件下,优化结构较常规器件结构的芯片总面积减小57%、单位面积峰值脉冲电流Ipeak增加112%、单位面积电流上升率dI/(dt·dS)提升122%。

关键词: 绝缘栅触发晶闸管, 高脉冲电流密度, 单位面积峰值脉冲电流, 单位面积电流上升率

Abstract: Insulated-gate trigger thyristors (IGTTs) are currently widely employed as core pulse switching devices in electronic fuse technology for explosive foil initiation, owing to their advantages such as simple driving requirements, high overcurrent capability, and high current rise rate. To ensure reliable initiation, the operating voltage of the switching device needs to be increased. However, as the operating voltage rises, the increase in junction termination size leads to a reduction in the active area of the chip, thereby restricting the development of the device toward high pulse current density. In this paper, the junction termination structure of a 2 000 V IGTT is optimized by improving the field limiting ring process and using the Medici TCAD simulation tool. Meanwhile, the cell structure is optimized and the backside process is improved, realizing an IGTT device structure with high voltage rating and high pulse current density. Experimental results show that at the same 2 000 V voltage rating, compared with the conventional device structure, the optimized structure reduces the total chip area by 57%, increases the peak pulse current per unit area Ipeak by 112%, and enhances the current rise rate per unit area dI/(dt·dS) by 122%.

Key words: insulated-gate trigger thyristors, high pulse current density, peak pulse current per unit area, current rise rate per unit area