关键词: 非制冷红外探测器, 非制冷红外焦平面阵列, 系统技术协同优化, 微系统集成, MEMS 工艺

Abstract: Uncooled infrared focal plane arrays (IRFPA) are widely employed in applications such as security surveillance, automotive night vision, and industrial thermography. Their performance is constrained by multiple interdependent factors, including material properties, device architecture, readout integrated circuits, and packaging technologies. With the growing demands for pixel shrinkage, array scaling, high sensitivity, and low cost, standalone module-level optimization strategies are no longer sufficient to simultaneously balance detection performance, cost-effectiveness, and reliability. system-technology co-optimization (STCO), which leverages cross-level multi-objective joint optimization, has emerged as a promising paradigm to break through the performance bottlenecks of IRFPA. This paper elucidates the core concept and applicability of STCO, and systematically analyzes the coupling interdependencies among system parameters, multi-physics fields, packaging processes, and readout circuits. Taking automotive night vision as a specific use case, a differentiated system-customized solution is proposed. Our study demonstrates that STCO can establish a full-link collaborative framework encompassing device design, packaging, and circuitry, enabling matched multi-physics co-parameterization. Finally, future development directions are discussed, including advanced multi-physics modeling, intelligent algorithms, and heterogeneous integration, providing theoretical references for the development of miniaturized, low-power IRFPA and the system-level co-design of MEMS sensors.

Key words: uncooled infrared detector, uncooled infrared focal plane array, system-technology co-optimization, microsystem integration, MEMS process