关键词: 分选机, SiP, 监测系统, 芯片测试

Abstract: During the automated testing process of integrated circuits, positioning deviation may cause the chip to be placed offset in the socket, ultimately leading to the risk of chip damage and scrapping. System-in-Package (SiP) chips are mainly applied in high-tech fields such as satellites, radar systems, and intelligent devices. Due to their precise internal structure and complex manufacturing process, their production costs are high. In particular, the above situation needs to be avoided during the automated testing process. This paper designs a monitoring system for the placement status of SiP chips. By detecting whether the chip blocks the opposite-emitting route of the optical fiber embedded in the chip test socket, it determines whether the automated testing equipment will continue to perform subsequent testing operations. When the system detects an abnormal state, it will immediately issue an alarm, thus effectively reducing the additional economic losses during the automated detection process.

Key words:  sort machine, SiP, monitor system, chip test