关键词: 基板烧结, 真空, 焊料, 空洞率

Abstract: There are many sintering methods for substrate sintering in microwave components, but it is difficult to control the sinter cavity rate, which makes the product quality and performance unable to meet the predetermined requirements. This paper introduces the method of vacuum sintering to solve the problem of large sinter hole rate. Through the analysis of the cause of cavity in the sintering of substrate, different measures are taken according to different factors. At the same time, the sintering process of the substrate is studied systematically, the process of vacuum sintering of the substrate is described in detail, and the process issummarized.

Key words: substrate sintering, vacuum, solder, void rate