关键词: 镀金盖板, 移印打标, 标识牢固性, 酚醛树脂

Abstract: Gold-plated cover plates are widely used in air-tight packaging of military integrated circuits. Surface marking is usually marked by ink pad printing. However, after the circuit is marked by pad printing, the problem that the logo is apt to fall off after the surface is pasted causes the user to fail to recognize it. By studying the curing mechanism of the thermosetting phenolic resin ink used in the pad printing process, the relationship between the circuit experiencing abnormal high temperature, flux contamination, cleaning agent cleaning and external friction and the firmness of the logo was determined, which effectively guided the surface mount manufacturers in precautions for subsequent surface mount.

Key words: gold-plated cover plates, marked by pad printing, firmness of the logo, phenolic resin