关键词: 多芯片组装, 共晶焊接, 真空度

Abstract: Eutectic soldering technology of multichip assembly by adding solder between the end of the chip and the metal electrode, the eutectic fusion of the two surfaces can be realized by proper temperature, time, vacuum degree and atmosphere. It has the advantages of low void ratio and high welding strength. Volatiles and oxygen in the solder in a closed furnace cavity can cause discoloration of the metal electrodes sheet, which can’t be removed by cleaning agent. In this paper, the relationship between the different vacuum degree and the color change of metal electrode is analyzed through the experimental research on the process of furnace chamber atmosphere and vacuum degree. The experimental results show that the discoloration of metal electrodes can be effectively solved by increasing the vacuum extraction action to discharge the harmful gas from the furnace chamber in the solder preheating stage and solder eutectic stage.

Key words: multichipassembly, eutecticsoldering, vacuumdegree