热固性环氧导电胶的失效机理分析

doi:10.16257/j.cnki.1681-1070.2021.0711

电子与封装 ›› 2021, Vol. 21 ›› Issue (7): 070402 . doi: 10.16257/j.cnki.1681-1070.2021.0711

热固性环氧导电胶的失效机理分析

井津域;刘德喜;史磊;景翠;康楠

北京遥测技术研究所，北京　100094

收稿日期:2021-01-26 出版日期:2021-07-22 发布日期:2021-04-25
作者简介:井津域（1993—），男，陕西商洛人，硕士研究生，工程师，研究领域为射频微波组件微组装工艺研发、先进封装工艺设计、先进封装可靠性及材料研究。

Failure Mechanism of Thermosetting EpoxyConductive Adhesive

JING Jinyu, LIU Dexi, SHI Lei, JING Cui, KANG Nan

Beijing Research Instituteof Telemetry, Beijing 100094, China

Received:2021-01-26 Online:2021-07-22 Published:2021-04-25

摘要/Abstract

摘要： 对热固性环氧导电胶在常温环境及高温环境下的失效过程进行了研究。研究显示，导电胶在常温下6~7 h内，其内部组分性能稳定，具有较好的流动性。回温时间超过7 h，工艺稳定性变差，这是由于导电胶内部稀释剂不断挥发，导致树脂基体在高温下难以形成稳定的三维空间结构。固化后导电胶加热至190 ℃以上，材料内部发生了Ag元素的富集，导致内应力增大。长时间加热导电胶，Ag元素会发生氧化反应，导致胶体表面氧元素增加。

关键词: 导电胶, 可靠性, 挥发, 三维结构, 银富集, 氧化反应

Abstract: In this study, the failure process and mechanism of thermosetting epoxy conductive adhesive is analyzed at room temperature and high temperature. The results show that the epoxy adhesive conserves stability and good fluidity within 6~7 hours at room temperature. However, the stability and the fluidity degrades with the recovery time exceeds 7 hours at room temperature. Due to the continuous evaporation of solvent inside the epoxy conductive adhesive, the resin matrix is difficult to form a stable 3D structure at high temperature. SEM results show Ag enrichment in the seams of resin matrix when the cured epoxy adhesive re-heated above 190 ℃. And if the epoxy adhesive is heated for a long time, the Ag will be oxidized, resulting an increase of Oxygen on the surface of the adhesive.

Key words: epoxyadhesive, stability, evaporation, threedimensionalstructure, Agenrichment, oxidationreaction

中图分类号:

TN454

井津域;刘德喜;史磊;景翠;康楠. 热固性环氧导电胶的失效机理分析[J]. 电子与封装, 2021, 21(7): 070402 .

JING Jinyu, LIU Dexi, SHI Lei, JING Cui, KANG Nan. Failure Mechanism of Thermosetting EpoxyConductive Adhesive[J]. Electronics & Packaging, 2021, 21(7): 070402 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

热固性环氧导电胶的失效机理分析

Failure Mechanism of Thermosetting EpoxyConductive Adhesive

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