射频系统2.5D/3D封装结构的研究进展

doi:10.16257/j.cnki.1681-1070.2021.0909

摘要/Abstract

摘要： 射频系统封装已经成为无线通信系统重要的集成技术，对于不断向高速率、小型化、多功能方向发展的无线通信系统，先进射频系统封装结构为其提供了坚实的基础。介绍了2.5D/3D射频系统封装结构的研究进程，重点分析了中介层结构、埋入结构、堆叠结构中的关键工艺，并从信号传输、电磁干扰、结构集成度等多角度出发，对不同封装结构做了深入剖析。探讨了射频系统封装结构发展遇到的难题，并对当今先进封装结构在未来射频系统中的应用做了简单的展望。

关键词: 射频系统封装, 中介层, 堆叠, 埋入, 3D封装

Abstract: RF system packaging has become an important integration technology of wireless communication system. Advanced RF system packaging structure provides a solid foundation for wireless communication system which is developing towards high speed, miniaturization and multi-function. This paper introduces the research process of 2.5D/3D RF system packaging structure, focuses on the analysis of the key technologies in the intermediate layer structure, embedded structure and stacked structure, and makes an in-depth analysis of different packaging structures from the perspectives of signal transmission, electromagnetic interference and structure integration. This paper discusses the problems encountered in the development of RF system packaging structure, and makes a simple prospect of the application of today's advanced packaging structure in the future RF system.

Key words: RFsystempackaging, interposer, stack, embedded, 3Dpackaging

中图分类号:

TN305.94

王豪杰;崔碧峰;王启东;许建荣;王翔媛;李彩芳. 射频系统2.5D/3D封装结构的研究进展[J]. 电子与封装, 2021, 21(9): 090205 .

WANG Haojie, CUI Bifeng, WANG Qidong, XU Jianrong, WANG Xiangyuan, LI Caifang. Research Progress of RF System2.5D/3D Package Structure[J]. Electronics & Packaging, 2021, 21(9): 090205 .

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中国半导体行业协会封装分会会刊

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