中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (8): 080403 . doi: 10.16257/j.cnki.1681-1070.2022.0815

• 材料、器件与工艺 • 上一篇    下一篇

基于薄外延的ESD结构设计

李晓蓉;吴建东;高国平   

  1. 中科芯集成电路有限公司,江苏 无锡 214072
  • 收稿日期:2022-03-28 出版日期:2022-08-26 发布日期:2022-05-11
  • 作者简介:李晓蓉 (1987—),女,江苏张家港人,本科,工程师,现从事集成电路设计工作。

ESD Structure Design Based on Thin Epitaxy

LI Xiaorong, WU Jiandong, GAO Guoping   

  1. China Key System & Integrated Circuit Co., Ltd.,Wuxi 214072, China
  • Received:2022-03-28 Online:2022-08-26 Published:2022-05-11

摘要: 采用薄外延圆片能有效提升抗辐射芯片的抗单粒子闩锁能力,但实测发现栅极接地MOS(GGMOS)结构在薄外延圆片下静电放电(ESD)性能衰减明显。对其衰减机理进行分析,设计了电源钳位ESD结构,对其进行了完整的ESD性能仿真,分析并优化了芯片ESD保护网络,实测结果表明ESD性能满足4 kV设计需求。

关键词: 静电放电保护, 薄外延片, 电源钳位

Abstract: Thin epitaxial wafer can effectively improve the single event latch-up resistance of radiation-hard chip, but the measured results show that the electrostatic discharge (ESD) performance of the gate grounded MOS (GGMOS) structure is obviously attenuated under the thin epitaxial wafer. The attenuation mechanism is analyzed, and the power clamp ESD structure is designed. The complete ESD performance is simulated, and the whole chip ESD protection network is analyzed and optimized. The measured results show that the ESD performance meets the 4 kV design requirement.

Key words: electrostatic discharge protection, thin epitaxial wafer, power clamp

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