先进封装RDL-first工艺研究进展

doi:10.16257/j.cnki.1681-1070.2023.0134

摘要/Abstract

摘要： 随着摩尔定律逐步达到极限，大量行业巨头暂停了7 nm以下工艺的研发，转而将目光投向先进封装领域。其中再布线先行（RDL-first）工艺作为先进封装技术的重要组成部分，因其具备高良率、高密度布线的优势吸引了大量研究者的目光。总结了RDL-first工艺的技术路线及优势，详细介绍其工艺进展，模拟其在程序中的应用，并对RDL-first工艺的发展方向进行展望，为RDL-first技术的进一步优化提供参考。

关键词: 先进封装, 再布线先行（RDL-first）, 高密度布线

Abstract: As Moore's Law gradually reaches its limits, a large number of industry giants have suspended the development of sub-7 nm processes and turned theirattentionto advanced packaging instead. The redistribution layer first(RDL-first)process, as an important part of advanced packagingtechnology, has attracted the attention of a large number of researchers due to its advantages of high yield and high density wiring. The technical route and advantages of the RDL-first process aresummarized, the progresses of its process are described in detail, and its applications in procedures are simulated.It also provides. An outlook on the development direction of the RDL-first process and a reference for further optimization of the RDL-first technology are provided.

Key words: advanced packaging, redistribution layer first (RDL-first), high density wiring

中图分类号:

TN305.94

张政楷,戴飞虎,王成迁. 先进封装RDL-first工艺研究进展[J]. 电子与封装, 2023, 23(10): 100205 .

ZHANG Zhengkai, DAI Feihu, WANG Chengqian. Research Progress of RDL-First Process in Advanced Packaging[J]. Electronics & Packaging, 2023, 23(10): 100205 .

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