关键词: LTCC, 微通道, 进出口布局结构, 有限元仿真, 散热特性

Abstract: Microchannel as the mainstream heat dissipation channel of micro-integrated systems, many factors related to its structure will affect the heat dissipation performance of the system, which in turn affects the normal operation of the entire system. In order to obtain the influence of the microchannel fluid inlet and outlet layout structure on the heat dissipation performance of the microsystem, a three-dimensional finite element model of a microwave TR component with LTCC substrate is established by using ANSYS finite element numerical simulation software, and the heat dissipation performance of four inlet and outlet layouts of microchannel fluids of the component is investigated by simulation analysis. The research results show that the four microchannel fluid inlet and outlet layout structures in the channel fluid pressure at the inlet is the largest, and the pressure at the outlet is the smallest. Diagonal type way inlet and outlet layout structure in the fluid pressure loss is the largest, and the flow rate and pressure distribution uniformity is relatively poor. Intermediate type inlet and outlet layout structure in which the flow rate and pressure distribution in the microchannel is more uniform than the other three, and the overall pressure loss is the smallest. Under the same boundary conditions and the same component chip power, the simulation results of the four fluid inlet and outlet layout structures show that the overall heat distribution of the microchannel inlet and outlet layout structure of the intermediate type mode is more uniform, with no obvious heat concentration phenomenon, and the comprehensive heat dissipation performance is better.

Key words: LTCC, microchannel, inlet and outlet layout structure, finite element simulation, heat dissipation properties