ABF塑封基板叠孔的高可靠结构设计

doi:10.16257/j.cnki.1681-1070.2024.0066

摘要/Abstract

摘要： 在塑封倒装焊结构中，有芯基板的布线过孔结构在温度循环载荷下的疲劳开裂是影响其可靠性的重要因素。为提升军用增强型有芯基板的设计可靠性，建立了基于Ansys有限元分析软件的塑封基板叠孔疲劳寿命仿真流程，通过子模型分析方法，预测了叠孔应力集中点的疲劳寿命，研究了叠孔位置、叠孔层数、芯层厚度、布线长度等因素对温度循环可靠性的影响。结果表明，铜布线结构最大应力应变点出现在叠孔底端与布线层连接处，这与实际生产中封装样品的失效模式一致，疲劳寿命仿真结果与实验结果相吻合。芯片对角位置叠孔的疲劳寿命比中心位置叠孔下降约36%。与2层叠孔相比，4层叠孔的疲劳寿命下降约55.6%。芯层厚度每增长0.4 mm，叠孔寿命相较于芯层厚度增加前分别下降约22.1%和27.5%。相较于370 μm布线结构中的叠孔，5 μm布线结构中叠孔的疲劳寿命下降约22.4%。

关键词: ABF基板, 塑料封装, 疲劳寿命, 有限元分析

Abstract: Fatigue cracking of the wiring through-hole structure of a cored substrate under temperature cyclic loading is an important factor affecting the reliability of the flip chip structure of plastic package. In order to improve the design reliability of military enhanced cored substrates, a fatigue life simulation process of the stacked holes of the plastic package substrates based on Ansys finite element analysis software is established, and the fatigue life of the stress concentration points of the stacked holes is predicted by the method of sub-model analysis, and the influences of factors such as the location of the stacked holes, the number of the stacked holes and the thickness of the core layer, and the length of the wiring on the reliability of the temperature cycling are investigated. The results show that the maximum stress-strain point of the copper wiring structure occurs at the connection between the bottom end of the stacked holes and the wiring layer, which is consistent with the failure mode of the package samples in the actual production, and the fatigue life simulation results are consistent with the experimental results. The fatigue life of the stacked holes in the diagonal position of the chip decreases by about 36% compared to the stacked holes in the center position. The fatigue life of 4-layer stacked holes decreases by about 55.6% compared to 2-layer stacked holes. For every 0.4 mm increase in core layer thickness, the fatigue life decreases by about 22.1% and 27.5% respectively, compared to that before the increase in core layer thickness. Compared to the stacked holes in the 370 μm wiring structure, the fatigue life of the stacked holes in the 5 μm wiring structure decreases by about 22.4%.

Key words: ABF substrate, plastic package, fatigue life, finite element analysis

中图分类号:

TN305.94

葛一铭,谢爽,吕晓瑞,刘建松,孔令松. ABF塑封基板叠孔的高可靠结构设计[J]. 电子与封装, 2024, 24(3): 030209 .

GE Yiming, XIE Shuang, LYU Xiaorui, LIU Jiansong, KONG Lingsong. Highly Reliable Structural Design of Stacked Holes for ABF Plastic Package Substrates[J]. Electronics & Packaging, 2024, 24(3): 030209 .

参考文献

[1] 储奕锋, 周毅, 陈海燕, 等. 高可靠塑料封装技术研究[J]. 电子产品可靠性与环境实验, 2021, 39(3): 64-69.
[2] 葛一铭, 徐琴, 曹鹏, 等. PoP元件热翘曲数值模拟及优化研究[J]. 电子元件与材料, 2022, 41(9): 980-986.
[3] 王晓珍, 熊盛阳, 张伟, 等. 军用塑封电路分层及可靠性方法研究[J]. 电子工艺技术, 2016, 37(6): 316-319.
[4] 李永强, 吕卫民. PBGA封装芯片热环境适应性仿真分析[J]. 北京航空航天大学学报, 2021, 47(9): 1892-1899.
[5] 周秀峰, 徐中国, 张振越. 高密度塑封基板倒装焊回流行为研究[J]. 电子产品可靠性与环境实验, 2022, 40(2): 16-20.
[6] LIU S, MEI Y H. Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering[J]. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995, 18(3): 634-645.
[7] SALAHOUELHADJ A, GONZALEZ M, VANSTREELS K, et al. Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation[J]. Microelectronic Engineering, 2023, 271/272(3): 111947.
[8] NAGAOKA H, AKAHOSHI T, FURUYAMA M, et al. Viscoelastic analysis of multistage stacked via structure in build-up substrate[C]// 2016 International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 2016: 548-552.
[9] 孙宏超, 王名浩, 谢添华, 等. 封装基板盲孔孔底铜层分离原因浅析[J]. 2016中日电子电路秋季大会暨秋季国际PCB技术信息/论坛论文集, 2016, 24(z2): 135-143.
[10] TOK L, XIONG Z, CHUA K H. Plated through-hole via cracking in laminated substrate of heat slug PBGA packages[C]// Proceedings of the 5th Electronics Packaging Technology Conference, Singapore, 2003: 589-594.
[11] LI R S. Optimization of thermal via design parameters based on an analytical thermal resistance model[C]// ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, WA, USA, 1998: 475-480.
[12] KOBAYASHI T, HAYASHIDA S. A study on reliability modeling for through hole cracking failure in thermal enhanced PBGA laminate[C]// 2000 Proceedings. 50th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2000: 1658-1660.
[13] GOVAL D, AZIMI H, CHONG K P, et al. Reliability of high aspect ratio plated through holes (PTH) for advanced printed circuit board (PCB) packages[C]//1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual, Denver, CO, USA, 1997: 129-135.
[14] LEICHT L, SKIPOR A. Mechanical cycling fatigue of PBGA package interconnects[J]. Microelectronics Reliability, 2000, 40(7): 1129-1133.
[15] LI S D, SINHA T, WASSICK T A, et al. Finite element modeling of C4 cracking in a large die large laminate coreless flip chip package[C]// 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2016: 271-276.
[16] 华嘉桢. IC封装基板的新一代过孔互连技术[J]. 印制电路信息, 2010, 18(12): 42-46.
[17] 张哲峰, 刘睿, 张振军, 等. 金属材料疲劳性能预测统一模型探索[J]. 金属学报, 2018, 54(11): 1693-1704.
[18] 高丽茵, 李财富, 刘志权, 等. 先进电子封装中焊点可靠性的研究进展[J]. 机械工程学报, 2022, 58(2): 185-202.
[19] 曹敬帅, 秦强, 张生鹏, 等. 基于温度应力实验的电子产品可靠性仿真分析[J]. 环境技术, 2023, 41(3): 31-37, 43.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊