高功率半导体用纳米银焊膏的研究现状*

doi:10.16257/j.cnki.1681-1070.2024.0059

摘要/Abstract

摘要： 在第3代半导体作为核心部件的前提下，更紧凑、高频率、高功率的电子器件在射频和微波电子、能源转换与储存、军事雷达和通信等领域展现出广泛的应用潜力。然而，高性能电子器件对其封装材料的导电性、导热性以及连接处的机械性能提出了更为严格的要求。纳米银焊膏因其卓越的低温烧结性能和在高温环境下的出色表现引起了广泛关注。然而，国内银粉和银焊膏产品的质量相对较低，且研发过程缺乏理论指导，必须依赖进口材料。基于高功率半导体用纳米银焊膏，综述了通过液相化学还原法合成纳米银粉的研究进展，以及纳米银焊膏的烧结机理、影响其性能的因素和控制方法，有望为国内纳米银焊膏的研发和生产提供有益的指导和支持。

关键词: 纳米银粉, 纳米银焊膏, 剪切强度, 热导率

Abstract: With third-generation semiconductors as core components, more compact, high-frequency, and high-power electronic devices have shown widespread application potential in fields such as radio frequency and microwave electronics, energy conversion and storage, military radar and communications. However, high-performance electronic devices require stricter requirements for the electrical conductivity and thermal conductivity of their packaging materials, and mechanical properties of the joints. Nano silver paste has attracted widespread attention due to its excellent low-temperature sintering performance and excellent performance in high-temperature environments. However, the quality of domestic silver powder and silver paste products is relatively low, and the research and development process lack theoretical guidance and must rely on imported materials. Based on the nano silver paste used in high-power semiconductors, the synthesis of nano silver powder using liquid phase chemical reduction method is reviewed, the sintering mechanism of nano silver solder paste and the factors affecting its performance and controllable methods are studied. These studies are expected to provide useful guidance and support for the research and production of nano silver paste in China.

Key words: nano silver powder, nano silver paste, shear strength, thermal conductivity

中图分类号:

TG425

张宸赫,李盼桢,董浩楠,陈柏杉,黄哲,唐思危,马运柱,刘文胜. 高功率半导体用纳米银焊膏的研究现状^*[J]. 电子与封装, 2024, 24(5): 050203 .

ZHANG Chenhe, LI Panzhen, DONG Haonan, CHEN Baishan, HUANG Zhe, TANG Siwei, MA Yunzhu, LIU Wensheng. Research Status of Nano Silver Solder Paste for High-Power Semiconductors[J]. Electronics & Packaging, 2024, 24(5): 050203 .

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唐思危（1984—），男，湖南张家界人，博士，副教授，主要研究方向为电子封装用焊料合金、多形貌微纳银粉和磁性纳米材料。

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

高功率半导体用纳米银焊膏的研究现状^*

Research Status of Nano Silver Solder Paste for High-Power Semiconductors

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