关键词: 封装技术, 回流焊, SMT器件, 热翘曲

Abstract: Integrated circuits are developing in the direction of miniaturization and high integration, and the reflow soldering process has become a key technology in their assembly process. Integrated circuits are prone to thermal warpage in the reflow soldering process. The thermal warpage of PBGA1296 and PBGA1024 devices under different reflow soldering process parameters, such as reflow soldering temperature and rise and fall temperature rates, is measured using the shadow cloud method, and the experimental results are analyzed by modelling simulation on this basis. The results show that the thermal warpage of BGA devices using surface mount technology (SMT) will increase with the reflow soldering temperature, and the fast reflow rise and fall temperature rate can also lead to severe thermal warpage. The experimental results are highly consistent with the simulation results, which in turn verifies the accuracy and validity of the simulation model. The method of experiments combined with finite element analysis provides a reference for improving the thermal warpage of integrated circuits.

Key words: packaging technology, reflow soldering, SMT device, thermal warpage