关键词: 封装技术, SurfaceEvolver, 焊点形态, CCGA

Abstract: In order to determine the range of process parameter combinations for a ceramic column grid array (CCGA) device to achieve high soldering reliability, and study the variation of solder joint morphology with different parameters, the wetting angle of brazing filler metal, the volume of brazing filler metal and the offset of soldering column are taken as the key variables, Surface Evolver software based on the principle of energy minimization is used to calculate the actual morphology of solder joints under different combination of factors, and the parametric modeling process is introduced in detail. By comparing the morphology result with the acceptable standards of the solder joints, the range of parameters that can generate the qualified solder joints is found, and the reasonable process guidance for the actual production process of the solder joint micro-connections is provided.

Key words: packaging technology, Surface Evolver, solder joint morphology, CCGA