关键词: 封装技术, 黏接剂, 渗胶, 气相清洗, 真空烘烤

Abstract: Hybrid integrated circuits realize the connection between components and substrates through adhesives. However, there is a problem of adhesive penetration during the process, whereby the relevant constituents of the adhesive overflow to the bonding area of the lead frame, resulting in the bonding strength of the bonded wires decreasing or failing to bond, thereby causing circuit connection problem. The adhesive penetration problem of thick film multilayer substrate and white ceramic substrate in the bonding process is studied, the correlation law between the phenomenon of adhesive penetration and the flux remaining in the gas phase cleaning solution is revealed, and an effective technological measure is proposed to improve the degree of adhesive penetration, so as to solve the adhesive penetration problem in the bonding process of hybrid integrated circuits.

Key words: packaging technology, adhesive, adhesive penetration, gas phase cleaning, vacuum baking