基于纳米铜膏的导电结构激光并行扫描烧结成型技术*

doi:10.16257/j.cnki.1681-1070.2025.0016

电子与封装 ›› 2025, Vol. 25 ›› Issue (1): 010402 . doi: 10.16257/j.cnki.1681-1070.2025.0016

基于纳米铜膏的导电结构激光并行扫描烧结成型技术^*

王文哲，李权震，余胜涛，笪贤豪，何伟伟，杨冠南，崔成强

广东工业大学省部共建精密电子制造技术与装备国家重点实验室，广州 ?510006

收稿日期:2024-07-23 出版日期:2025-01-22 发布日期:2025-01-22
作者简介:王文哲（2000—），男，广东韶关人，硕士研究生，主要研究方向为微电子封装工艺与材料。

Laser Parallel Scanning Sintering Forming Technology for Conductive Structures Based on Nano Copper Paste

WANG Wenzhe, LI Quanzhen, YU Shengtao, DA Xianhao, HE Weiwei, YANG Guannan, CUI Chengqiang

State Key Laboratoryof Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China

Received:2024-07-23 Online:2025-01-22 Published:2025-01-22

摘要/Abstract

摘要： 针对柔性基板中导电结构的快速成型，对纳米铜膏的多道激光并行扫描烧结技术进行了优化。探究了不同功率和填充间距对激光烧结过程中的纳米铜膏烧结形貌和电阻率的影响，得出最佳的工艺参数。适当缩小间距可提高烧结程度和导电性，但间距过小易导致基板过热。实验结果表明，最佳工艺参数组合为功率170 mW、间距10 μm、光斑直径15 μm，此时烧结线路呈现金属铜色，并形成网状烧结结构，测得电阻率为5.32×10^－6 Ω·cm。对比聚酰亚胺（PI）和聚对苯二甲酸乙二醇酯（PET）薄膜在激光烧结过程中的效果，分析了基板的耐热性和透光性对烧结效果的影响机理，为后续清洗工艺提供可行性参考。

关键词: 激光烧结, 导电结构, 基板材料, 纳米铜膏

Abstract: Aiming at the rapid prototyping of conductive structures in flexible substrates, the multi-channel laser parallel scanning sintering technology of nano copper paste is optimized. The effects of different power and filling spacing on the sintering morphology and resistivity of nano copper paste during laser sintering process are investigated, and the best process parameters are obtained. Proper reduction of the spacing can improve the sintering degree and electrical conductivity, but too small spacing can easily lead to overheating of the substrates. The experimental results show that the optimal combination of parameters is a power of 170 mW, a spacing of 10 μm and a spot diameter of 15 μm, at this time, the sintered wire presents a metallic copper color and forms a reticulated sintering structure, and the measured resistivity is 5.32×10^-6 Ω·cm. The effects of polyimide (PI) and polyethylene terephthalate (PET) films in laser sintering process are compared, and the influence mechanism of heat resistance and transparency of substrate on sintering effect is analyzed, which provides the feasible reference for the subsequent cleaning process.

Key words: laser sintering, conductive structure, substrate material, nano copper paste

中图分类号:

TN305.94

王文哲，李权震，余胜涛，笪贤豪，何伟伟，杨冠南，崔成强. 基于纳米铜膏的导电结构激光并行扫描烧结成型技术^*[J]. 电子与封装, 2025, 25(1): 010402 .

WANG Wenzhe, LI Quanzhen, YU Shengtao, DA Xianhao, HE Weiwei, YANG Guannan, CUI Chengqiang. Laser Parallel Scanning Sintering Forming Technology for Conductive Structures Based on Nano Copper Paste[J]. Electronics & Packaging, 2025, 25(1): 010402 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

基于纳米铜膏的导电结构激光并行扫描烧结成型技术^*

Laser Parallel Scanning Sintering Forming Technology for Conductive Structures Based on Nano Copper Paste

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