中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2025, Vol. 25 ›› Issue (6): 060205 . doi: 10.16257/j.cnki.1681-1070.2025.0064

• 封装、组装与测试 • 上一篇    下一篇

一款高频QFN48陶瓷管壳的设计

陈莹,成燕燕,王波,李祝安   

  1. 无锡中微高科电子有限公司,江苏 无锡? 214035
  • 收稿日期:2024-11-06 出版日期:2025-06-27 发布日期:2025-01-20
  • 作者简介:陈莹(1996—),女,江苏无锡人,硕士,工程师,主要研究方向为信号完整性、高频高速信号封装设计、光电模块设计。

Design of a High-Frequency QFN48 Ceramic Tube Shell

CHEN Ying, CHENG Yanyan, WANG Bo, LI Zhu’an   

  1. Wuxi Zhongwei High-Tech Electronics Co., Ltd., Wuxi 214035, China
  • Received:2024-11-06 Online:2025-06-27 Published:2025-01-20

摘要: 随着集成电路不断向小尺寸、高速化的方向发展,陶瓷管壳的应用频段要求逐渐提高。设计了一款方形扁平无引脚(QFN)封装的陶瓷管壳,通过对其键合指和腔体的参数化设计确定了设计方案,利用测试板和陶瓷50 Ω传输线搭建完整测试链路。结果显示,设计的QFN48管壳组成的全链路可覆盖0~5 GHz高速传输。

关键词: 方形扁平无引脚封装, 管壳设计, 全链路

Abstract: With the continuous development of integrated circuits towards small size and high speed, the applicable frequency band requirements for ceramic tube shells are gradually increasing. A quad flat no-lead (QFN) packaging ceramic tube shell is designed. The design scheme is determined through parametric design of its bonding fingers and cavity. A complete testing link is built using a test board and a ceramic 50 Ω transmission line. The results show that the full link composed of the designed QFN48 package can cover high-speed transmission from 0 to 5 GHz.

Key words: quad flat no-lead package, tube shell design, full link

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