光电共封装技术及其在光学相控阵中的应用研究

doi:10.16257/j.cnki.1681-1070.2025.0067

摘要/Abstract

摘要： 光电共封装（CPO）技术采用先进封装技术将电子集成电路和光子集成电路异质集成在同一封装体中，具有紧凑度高、功耗低和容量大等优点。该技术被视作下一代光电子技术的关键方向，也为高性能集成光波导光学相控阵（OPA）提供了一种有效的实现途径。综述了3种典型CPO技术的最新研究进展，并从结构集成度、工艺实现性、封装体性能等方面剖析了不同集成方案。进一步地，概述了CPO技术在集成光波导OPA中应用的最新研究进展，并探讨了CPO技术应用于每种OPA中的优势与面临的问题。从高密度封装、高效散热、电子-光子联合仿真等方面探讨了CPO技术在高性能集成光波导OPA中广泛应用和产业化所面临的挑战。

关键词: 光电共封装, 光学相控阵, 集成光波导, 先进封装

Abstract: Co-packaged optics (CPO) technology adopts advanced packaging technology to heterogeneously integrate electronic integrated circuits and photonic integrated circuits into the same package, which has the advantages of high compactness, low power consumption, and large capacity. This technology is considered a key direction for the next generation of optoelectronic technology and provides an effective implementation approach for high-performance integrated optical waveguide optical phased array (OPA). An overview of the latest research progress on three typical CPO technologies is summarized, and the different integration schemes in terms of structural integration, process feasibility, and packaging performance are analyzed. Furthermore, the latest research progress on the application of CPO technology in integrated optical waveguide OPA is summarized, and the advantages and challenges of applying CPO technology to each type of OPA are discussed. The challenges faced by the widespread application and industrialization of CPO technology in high-performance integrated optical waveguide OPA are discussed from the aspects of high-density packaging, efficient heat dissipation, and electronic-photonic co-simulation.

Key words: co-packaged optics, optical phased array, integrated optical waveguide, advanced packaging

中图分类号:

TN305.94

张郭勇. 光电共封装技术及其在光学相控阵中的应用研究[J]. 电子与封装, 2025, 25(6): 060206 .

ZHANG Guoyong. Research on Co-Packaged Optics Technology and Its Application in Optical Phased Array[J]. Electronics & Packaging, 2025, 25(6): 060206 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊