中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2022, Vol. 22 ›› Issue (1): 010401 -0. doi: 10.16257/j.cnki.1681-1070.2022.0107

• 材料、器件与工艺 • 上一篇    下一篇

基于0.18 μm CMOS加固工艺的抗辐射设计

姚进,周晓彬,左玲玲,周昕杰   

  1. 中科芯集成电路有限公司,江苏 无锡 214072
  • 收稿日期:2021-06-15 修回日期:2021-07-09 出版日期:2022-01-25 发布日期:2021-08-06
  • 通讯作者: 姚进

Radiation Hardened Design Based on 0.18 μm CMOS Reinforcement Process

YAO Jin, ZHOU Xiaobin, ZUO Lingling, ZHOU Xinjie   

  1. China Key System & Integrated Circuit Co., Ltd., Wuxi 214072, China
  • Received:2021-06-15 Revised:2021-07-09 Online:2022-01-25 Published:2021-08-06

摘要: 为降低抗辐射设计对元器件基本性能的影响,基于0.18 μm CMOS加固工艺,通过场区注入工艺实现总剂量(Total Ionizing Dose, TID)加固,优化版图设计规则实现单粒子闩锁(Single Event Latch-up, SEL)加固,灵活设计不同翻转指标要求实现单粒子翻转(Single Event Upset, SEU)加固。利用以上加固方法设计的电路,证明了加固工艺平台下的抗辐射电路在抗辐射性能及面积上具有明显优势。

关键词: 抗辐射, 总剂量, 单粒子闩锁, 单粒子翻转, 全局三模冗余

Abstract: In order to reduce the influence of radiation hardened design on the basic performance of components, based on 0.18 μm CMOS radiation-hard process, total ionizing dose (TID) harden is realized by field injection, and single event latch-up (SEL) harden is realized by optimizing the layout design rule, and single event upset (SEU) harden is realized by flexible design technology for different specification. Through developing circuits by above methods, it is verified that the radiation harden circuit designed by radiation-hard process has obvious advantages in radiation harden performance and circuit area.

Key words: radiation hardened, total ionizing dose, single event latch-up, single event upset, global triple module redundant