关键词: 平面传输结构, 高次模式, 截止频率, 陶瓷封装

Abstract: Based on high temperature co-fired ceramic (HTCC) technology, the housing for electronic packaging is fabricated. The influence of the ceramic housing structure on the cut-off frequency of the transmission channel is analyzed by theoretical and full-wave electromagnetic simulation software, and the relationship between the higher order modes and the cut-off frequency of the transmission is mainly analyzed. The research shows that in the planar transmission structure dominated by wire bonding, the width of the signal line and the height of the signal line to the ground are inversely proportional to the transmission cut-off frequency. By changing the width of the signal line and the height to ground, the cut-off frequency of the transmission model is increased from 40 GHz to 70 GHz. The ceramic insulators with different structures are tested by GSG probes. The experimental results show that the cut-off frequency is consistent with the frequency at which the higher order modes starts to propagate, which verifies that the cut-off frequency of the interconnection structure is mainly affected by the excited higher order modes. And the measured values are in good agreement with the simulation results.

Key words: planar transmission structure, higher order modes, cut-off frequency, ceramic package