中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (5): 050205 . doi: 10.16257/j.cnki.1681-1070.2023.0055

• 封装、组装与测试 • 上一篇    下一篇

人工智能芯片及测评体系分析*

赵玥;肖梦燕;罗军;王小强;罗道军   

  1. 工业和信息化部电子第五研究所,广州 510610
  • 收稿日期:2022-10-09 出版日期:2023-05-23 发布日期:2023-05-23
  • 作者简介:赵玥(1990—),女,陕西西安人,博士,工程师,主要研究方向为人工智能、图像处理。

Analysisof Artificial Intelligence Chip and Evaluation System

ZHAO Yue, XIAO Mengyan, LUO Jun, WANG Xiaoqiang, LUO Daojun   

  1. China Electronic ProductReliability and Environmental Testing Research Institute, Guangzhou 510610, China
  • Received:2022-10-09 Online:2023-05-23 Published:2023-05-23

摘要: 芯片是许多尖端数字设备的基础核心部件,随着自动驾驶、人工智能、5G技术和物联网时代的到来,AI芯片的开发与应用逐渐成了各界关注的焦点。AI芯片是指专门设计用于处理人工智能任务的新一代微处理器,具有能效高、耗电少等优势,能够在汽车制造、智能家电、机器人等领域中发挥重要作用。从定义、功能、技术架构和测评体系等多方面对AI芯片进行了介绍,对现有AI芯片测评体系及特点、AI芯片基准测试平台以及AI芯片测评标准进行了详细研究,并概述了AI芯片测评的发展趋势。

关键词: 人工智能, AI芯片, 基准测评, 测评标准

Abstract: Chips are the basic and core components of many cutting-edge digital devices. With the advent of the era of autonomous driving, artificial intelligence, 5G technology and the Internet of Things, the development and application of AI chips have gradually become the focus of attention from all walks of life. AI chips refer to a new generation of microprocessors specially designed to deal with artificial intelligence tasks, with advantages such as high energy efficiency and low power consumption, and can play an important role in the fields of automobile manufacturing, intelligent household appliances, robots and so on. AI chips are introduced from many aspects, such as definition, function, technical architecture and evaluation system. The existing AI chip evaluation system and characteristics, AI chip benchmarks and AI chip evaluation standards are introduced in detail, and an overview of the development trend of AI chip evaluation is proposed.

Key words: artificial intelligence, AI chip, benchmark test, evaluation standard

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