中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (6): 060201 . doi: 10.16257/j.cnki.1681-1070.2023.0067

• 封装、组装与测试 •    下一篇

基于特征参数仿真的引线键合强度测量系统分析

牛文娟;饶张飞;刘瀚文   

  1. 西安微电子技术研究所,西安 710119
  • 收稿日期:2022-10-18 出版日期:2023-06-26 发布日期:2023-06-26
  • 作者简介:牛文娟(1986—),女,山西临汾人,硕士,高级工程师,主要从事元器件生产中统计过程控制技术的应用研究。

Analysis of Wire Bonding Strength Measurement System Based on

NIU Wenjuan, RAO Zhangfei, LIU Hanwen   

  1. Xi’an Microelectronic Technology Institute, Xi’an 710119, China
  • Received:2022-10-18 Online:2023-06-26 Published:2023-06-26

摘要: 引线键合强度测量具有破坏性和不可重复测试的特性,无法采用传统的测量系统分析方法对其进行分析。采用对工艺参数总体分布的特征参数的均值和标准偏差仿真的方法,选择服从相同正态分布的标准砝码作为替代样本。利用方差分析法计算引线键合强度测量系统的重复性和再现性,分析替代样本与操作者的交互作用。基于特征参数仿真的测量系统分析方法可以反映引线键合强度测量系统的精密度,降低了产线统计过程控制的成本。

关键词: 键合强度, 替代样本, 特征参数仿真, 方差分析法, 测量系统分析

Abstract: The measurement of wire bonding strength is destructive and non-repeatable, which cannot be analyzed using traditional measurement system analysis methods. The method of simulating the mean value and standard deviation of characteristic parameters of the overall distribution of process parameters is adopted, and the standard weights subjected to the same normal distribution are selected as the alternative samples.The repeatability and reproducibility of the wire bonding strength measurement system are calculated using the analysis of variance method, and the interaction between the alternative samples and the operator is analyzed.The measurement system analysis method based on characteristic parameter simulation can reflect the precision of wire bonding strength measurement system, reducing the statistical process control cost of production?line.

Key words: bondstrength, alternative samples, characteristic parameter simulation, analysis ofvariancemethod, measurement systemanalysis

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