关键词: 破坏性键合拉力, 测量系统分析

Abstract: Wire bonding is a key process in the semiconductor package process, in which destructive wire bonding pull is one of the key items for evaluating the bonding quality. In order to ensure the correctness of the destructive bond pull test results, the measurement system that obtains the measurement data is evaluated by using the Measurement System Analysis (MSA) method. The measurement system analysis mainly evaluates the repeatability and reproducibility of the measurement system. The repeatability and reproducibility of the measurement system are determined by the Gauge R&R study. Measurement system analysis is also one of the core elements of the ISO/TS 16949 standard. The measurement system can be divided into non-destructive testing systems and destructive testing systems based on the characteristics of its measurement objects. The analysis methods of the two testing systems are quite different. For destructive measurement systems, there are not many academic papers currently studied. In this article, based on an example, the measurement system analysis method of the destructive wire bonding pull test was discussed through using Minitab software based on an example.

Key words: destructive wire bondingpull, measurement system analysis (MSA)