无芯封装基板应力分析与结构优化*

doi:10.16257/j.cnki.1681-1070.2023.0102

电子与封装 ›› 2023, Vol. 23 ›› Issue (8): 080203 . doi: 10.16257/j.cnki.1681-1070.2023.0102

无芯封装基板应力分析与结构优化^*

李轶楠^1,2;杨昆^1,2;陈祖斌^1,2;姚昕^1,2;梁梦楠^1,2;张爱兵^1,2

1. 无锡中微高科电子有限公司，江苏无锡　214035；2. 中科芯集成电路有限公司，江苏无锡　214072

收稿日期:2023-01-08 出版日期:2023-08-24 发布日期:2023-07-12
作者简介:李轶楠（1988—），男，辽宁朝阳人，硕士，工程师，现从事半导体封装技术、封装基板的研发工作。

Stress Analysis and Structural Optimization of Coreless Package Substrates

LI Yi’nan^1,2, YANG Kun^1,2, CHEN Zubin^1,2, YAO Xin^1,2, LIANG Mengnan^1,2, ZHANG Aibing^1,2

1.Wuxi Zhongwei High-tech Electronics Co.,Ltd., Wuxi 214035, China;2.China Key System & Integrated Circuit Co., Ltd.,Wuxi 214072, China

Received:2023-01-08 Online:2023-08-24 Published:2023-07-12

摘要/Abstract

摘要： 封装基板作为集成电路的载体，可以实现芯片的电连接、支撑保护及散热等。因此，封装基板的可靠性至关重要。在封装基板的加工过程中，热、机械等因素如铜含量分布不均衡、材料的热膨胀系数（CTE）不匹配等均可能导致基板出现翘曲、开裂等现象，进而导致基板出现短路、断路，从而影响元器件的功能。采用有限元分析法，对无芯封装基板在加工过程中所经历的热、机械情况进行模拟，分析了基板设计对基板翘曲、应力分布的影响。通过对基板设计进行优化改进、仿真验证、样品加工验证，无芯基板加工过程中的断裂现象得到显著改善。

关键词: 封装基板, 翘曲断裂, 有限元分析法, 设计优化

Abstract: Package substrates as the carrier of the integrated circuitscan realize the electrical connection, support protection and heat dissipation of chips. Therefore, the reliability of package substrates is very crucial.In the processing of package substrates, thermal and mechanical factors such as uneven distribution of copper content and mismatch in the coefficient of thermal expansion (CTE) of the material may lead to warping and cracking of the substrate, which in turn may lead to short circuits and broken circuits, thus affecting the function of the components.Finite element analysis is used to simulate the thermal and mechanical conditions experienced by the coreless package substrate during processing, and the influence of substrate design on substrate warping and stress distribution is analyzed.Through optimization and improvement of the substrate design, simulation verification and sample processing verification, the fracture phenomenon during the processing of coreless substrates has been significantly improved.

Key words: package substrates, warpage fracture, finite element analysis method, design optimization

中图分类号:

TN305.94

李轶楠, 杨昆, 陈祖斌, 姚昕, 梁梦楠, 张爱兵. 无芯封装基板应力分析与结构优化^*[J]. 电子与封装, 2023, 23(8): 080203 .

LI Yi’nan, YANG Kun, CHEN Zubin, YAO Xin, LIANG Mengnan, ZHANG Aibing. Stress Analysis and Structural Optimization of Coreless Package Substrates[J]. Electronics & Packaging, 2023, 23(8): 080203 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

无芯封装基板应力分析与结构优化^*

Stress Analysis and Structural Optimization of Coreless Package Substrates

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