关键词: 低温共烧陶瓷, 陶瓷封装, 散热通孔, 热仿真

Abstract: Design of heat dissipation vias in low temperature co-fired ceramic (LTCC) packagingis one of the important contents of integrated circuit packaging design. Taking a CLCC40-type LTCC packaging shell as an example,3D modeling and steady-state thermal simulation are conducted on several different heat dissipation vias designs using finite element simulation software.By comparing the thermal resistance simulation results of the chip junction to the packaging shell, the optimized design of the heat dissipation viasis obtained. The simulation results show that the heat dissipation effect of the LTCC packaging shell with this design is better than the aluminum oxide ceramic packaging shell with a mass fraction of 92%, but slightly worse than the aluminum nitride ceramic packaging shell.

Key words: low temperature co-fired ceramic, ceramic packaging, heat dissipation vias, thermal simulation