中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (3): 05 -10. doi: 10.16257/j.cnki.1681-1070.2019.0025

• 封装、组装与测试 • 上一篇    下一篇

双面空腔LTCC基板制造工艺研究

何中伟,高 亮   

  1. 中国兵器工业第214所,江苏 苏州 215163
  • 出版日期:2019-03-20 发布日期:2020-01-16
  • 作者简介:何中伟(1962—),男,安徽安庆人,研究员级高工,主要研究方向为混合集成电路、多芯片组件及低温共烧陶瓷微波集成组件的工艺技术。

Study of Double-side Cavity’s LTCC Substrate Manufacturing Process

HE Zhongwei, GAO Liang   

  1. No. 214 Research Institute of CNIGC, Suzhou 215163, China
  • Online:2019-03-20 Published:2020-01-16

摘要: 通过渐次优化改进叠片台、空腔填充塞、衬垫聚酯膜、烧结垫片等工装及相应工艺方法,重点研究突破了双面空腔LTCC的叠片、生瓷坯层压和生瓷块共烧等难点工艺,有效掌握了双面空腔LTCC基板制造工艺技术,达到了腔底平整度不大于0.08 mm、空腔尺寸准确度优于±0.15 mm的关键技术指标,成功研制出满足应用要求的双面空腔LTCC基板。

关键词: LTCC基板;双面空腔;叠片;层压;共烧;腔底平整度

Abstract: By gradual improvement of the process tools as the sheet stacker, cavity plug, polymer liner, co-firing cushion, etc. and the corresponding process methods, the difficult processes of double-side cavity’s LTCC as stacking, block lamination and brick co-firing were emphatically studied and broken through. The double-side cavity’s LTCC substrate manufacturing process technology was effectively mastered. The key technical parameters were reached: cavity bottom flatness is not larger than 0.08mm and cavity dimension precision is better than ± 0.15 mm, and moreover, the double-side cavity’s LTCC substrate which fulfilled the application requirements was successfully developed.

Key words: LTCC substrate; double-side cavity; stacking; lamination; co-firing; cavity bottom flatness

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