关键词: 高温共烧陶瓷, 高导热, 散热设计, 复合金属材料, 氮化铝陶瓷

Abstract: High temperature co-fired ceramic (HTCC) packages play a pivotal role in electronic packaging due to their superior performance. With the widespread application of high power devices, increasingly stringent demands have been placed on the thermal management capabilities of ceramic packaging shells. The characteristics, principal architectures, thermal conduction mechanisms, and the factors affecting thermal conductivity in HTCC packages are identified. Recent advances in high thermal conductivity ceramic packaging shells are systematically summarized from thermal design of the packaging shell, ceramic thermal interface materials, and metallic thermal interface materials. The future research for high thermal conductivity packaging materials is outlined.

Key words: high temperature co-fired ceramic, high thermal conductivity, heat dissipation design, composite metal material, AlN ceramic