关键词: 钨粉, 高温共烧陶瓷, 颗粒度, 翘曲, 孔隙率

Abstract: Three kinds of tungsten powders with different particle size ranges (0.5-0.8 μm, 1-3 μm and 6-10 μm) are selected, they are mixed according to specific mass ratio, and co-fired with alumina ceramics at high temperature to prepare metallization layer. The experimental results show that the warpage of the tungsten metallization layer is closely related to the variation of sintered porosity, but the relationship is not a simple positive correlation. When using tungsten powder with a single small particle size, the film layer exhibits the highest porosity (23.2%), the uniform distribution of particles reduces the sintering stress gradients, while the high porosity buffers the internal stresses, resulting in the lowest warpage (0.016). It is indicated that tungsten powder particle gradation has a significant impact on the sintering behavior and warpage of high-temperature co-fired ceramics (HTCCs) by regulating particle rearrangement and stress distribution. In particular, submicron and small particle size tungsten powders are mixed at a mass ratio of 9∶11, which can reduce the porosity of the film (12.98%) and control the warpage at a low level (0.03), thus achieving balanced optimization of performance. This study provides a theoretical basis for the optimization of HTCCs production process by balancing porosity and warpage through particle gradation design, and is of great significance to enhance product market competitiveness and meet the development needs of microelectronics technology.

Key words: tungsten powder, high-temperature co-fired ceramic, particle size, warpage, porosity