中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装 ›› 2026, Vol. 26 ›› Issue (3): 030401 . doi: 10.16257/j.cnki.1681-1070.2026.0032

• 材料、器件与工艺 • 上一篇    下一篇

无衬底Micro LED芯片直显研究进展*

梁劲豪,余亮,陈勇林,屠孟龙   

  1. 深圳雷曼光电科技股份有限公司,广东 深圳  518055
  • 收稿日期:2025-08-15 出版日期:2026-04-02 发布日期:2025-09-29
  • 作者简介:梁劲豪(1994—),广东揭阳人,硕士,雷曼光电技术研发中心材料开发主任工程师,从事LED封装材料和产品开发工作。

Research Progress on Substrate-Free Micro LED Chips for Direct Display

LIANG Jinhao, YU Liang, CHEN Yonglin, TU Menglong   

  1. Ledman Optoelectronic Co., Ltd., Shenzhen 518055, China
  • Received:2025-08-15 Online:2026-04-02 Published:2025-09-29

摘要: Micro LED技术具有众多优势,如高亮度、高对比度、高分辨率、低功耗以及长寿命等。随着芯片尺寸逐渐减小,无衬底Micro LED芯片应用研究需求越来越迫切。得益于无衬底Micro LED芯片的微小尺寸,屏体发光单元占屏体整体面积不足1%,底黑区域占比的提升能显著提高屏体的对比度。简要对比了Micro LED在PM以及AM玻璃基板上的应用。其中PM驱动玻璃基板线宽、线距最小可达12 μm(传统PCB基板极限为50 μm),因此PM玻璃基板更适配微小尺寸芯片。PM玻璃基板与巨量通孔技术和厚铜技术结合能实现成本与显示效果之间的平衡。同时针对玻璃基板存在的强度以及可靠性问题进行了相对应的方案设计并实现了预期目标。与之相对的AM驱动LED显示屏采用全倒装高压μA级晶片,使用电压为12 V的开关电源,通过高电压、低电流驱动模式,能显著降低电流密度,同时AM驱动的像素级精准调控支持任意区域独立升压,可实现局部峰值亮度显示。PM和AM驱动玻璃基板分别通过不同的方案实现无衬底Micro LED芯片在直显方面的应用,推动显示技术向超高清、低功耗方向迭代。

关键词: 无衬底MicroLED芯片, 直显, PM玻璃基板, AM玻璃基板

Abstract: Micro LED technology offers numerous advantages, such as high brightness, high contrast ratio, high resolution, low power consumption, and long lifespan. As chip sizes continue to decrease, research into the application of substrate-free Micro LED chips is becoming increasingly urgent. Thanks to the small dimension of substrate-free Micro LED chips, the light-emitting units account for less than 1% of the display’s total area. The increase of the proportion of the black background area can significantly improve the display’s contrast ratio. The applications of Micro LED on PM (passive matrix) and AM (active matrix) glass substrates are briefly compared. PM-driven glass substrates can achieve a minimum line width/spacing of 12 μm (compared to the 50 μm limit of traditional PCB substrates), making them suitable for even smaller chip sizes. The combination of PM glass substrates with massive through glass via and thick copper technologies strikes a balance between cost and display performance. Meanwhile, targeted design solutions are implemented to address the strength and reliability issues associated with glass substrates and have achieved the expected results. AM-driven LED displays utilize fully flip-chip high-voltage μA-level chips and a 12 V switching power supply. The high-voltage, low-current driving mode significantly reduces current density. Simultaneously, the pixel-level precise control enabled by AM driving supports independent voltage boosting in any arbitrary area, allowing for localized peak brightness display. PM and AM-driven glass substrates enable the application of substrate-free Micro LED chips in direct-view displays through different approaches, thereby driving the evolution of display technology toward ultra-high definition and low power consumption.

Key words: substrate-free Micro LED chip, direct display, PM glass substrate, AM glass substrate

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