The Behavior of Underfill Adhesive on the Different Treatment Ceramic Package
LI Jingxuan1,LIU Pei2,LIAN Binhao1,LIN Pengrong1,HUANG Yingzhuo1
1.Beijing Microelectronics Technology Institution,Beijing 100076,China;2.China Academy of Aerospace Standardization and Product Assurance,Beijing 100071,China
LI Jingxuan1,LIU Pei2,LIAN Binhao1,LIN Pengrong1,HUANG Yingzhuo1. The Behavior of Underfill Adhesive on the Different Treatment Ceramic Package[J]. Electronics & Packaging, 2018, 18(3):
1 -4.
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