关键词: MIS, 嵌入式封装, 铜柱, 半蚀刻

Abstract: MIS is an emerging electronic packaging technology developed for high reliability and panel level embedded packaging. Due to its flexible trace routing capability, unique material structure, process features and surface roughness treatment, MIS is of higher reliability, better electrical and thermal performance compared to standard BGA, QFN or other package types. MIS process’s flexibility has distinguished it in embedded packaging or SiP packaging arena. At present, MIS has been widely applied to RF device and power management devices of cell phone, industrial control, IoT, etc. In the paper, technological features, packaging application and E&T performance of MIS technology are presented and the process flow is overviewed.

Key words: MIS, embedded packaging, copper pillar, half-etching