关键词: 环氧树脂, 酚醛树脂, 黏度, 环氧塑封料

Abstract: Five types of epoxy molding compounds are prepared using biphenyl polyaromatic epoxy resin as matrix and biphenyl polyaromatic phenolic resin as curing agent. The epoxy molding compounds are characterized by electric heating plate, capillary rheometer, Shore thermal hardness tester, dynamic thermomechanical analyzer, universal tensile testing machine and ultrasonic scanner. The results show that when the viscosity of epoxy resin is increased from 1.2 Pa·s to 3.7 Pa·s and the viscosity of phenolic resin is increased from 0.8 Pa·s to 1.5 Pa·s, the gelation time of epoxy molding compounds is decreased from 31 s to 22 s; the helical flow length is decreased from 137.16 cm to 88.90 cm, which is a reduction of 35.2%; the viscosity of the epoxy molding compounds is increased from 19.6 Pa·s to 35.8 Pa·s, which is an increase of 82.7%; the number of the internal pores is reduced from 20 to 4. These changes indicate a decrease in adhesion and an increase in modulus of epoxy molding compounds. The effect of viscosity of epoxy resin on the properties of epoxy molding compounds is greater than that of viscosity of phenolic resin.

Key words: epoxy resin, phenolic resin, viscosity, epoxy molding compounds