中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (6): 060202 . doi: 10.16257/j.cnki.1681-1070.2021.0607

• 封装、组装与测试 • 上一篇    下一篇

集成电路测试中测试Map的“重生”技术

张亚军;陆坚   

  1. 中科芯集成电路有限公司,江苏 无锡 214072
  • 收稿日期:2020-11-15 出版日期:2021-06-23 发布日期:2021-01-19
  • 作者简介:张亚军(1978—),男,江苏江都人,本科,高级工程师,现从事集成电路测试技术、设备自动化和信息化建设等研究工作。

"Rebirth"Technology of Test Map in Integrated Circuit Test

ZHANG Yajun, LU Jian   

  1. China Key System & Integrated Circuit Co.,Ltd., Wuxi 214072, China
  • Received:2020-11-15 Online:2021-06-23 Published:2021-01-19

摘要: 晶圆测试每完成一片晶圆都会生成一张测试Map,在晶圆没有进行研磨、划片、挑粒和键合等封装工序之前,这张测试Map就是这片晶圆的“身份证”。“身份证”办理通常分为首次“申领”和“补办”等,首次“申领”适用于晶圆常规测试流程,“补办”适用于二次及以上处理,其场景包括但不限于测试数据存在但测试Map丢失、客户提供电子Map要求测试但非探针台接受格式等情况。测试Map补办“身份证”的需求促使测试Map的“重生”技术应运而生。以TSK系列探针台为例,介绍了测试Map“重生”的技术流程,为这一特殊生产流程的进一步研究提供参考。

关键词: 晶圆测试, 测试Map, 重生

Abstract: Chip Probing will generate a test map for each wafer completed. Each test map is the wafer's "ID card" before the wafer is subjected to packaging processes such as grinding, dicing, picking and bonding. ID card processing is usually divided into first application and reissue, etc. The first application is applicable to the routine chip probing process. Replenishment is suitable for secondary and above processing, and its scenarios include but are not limited to the following situations: test data exists, but test map is lost; customer provides electronic map for testing, but the format is not accepted by probe station and so on. The need to reissue the "ID card" of the test map prompted the "rebirth" technology of the test map to emerge.

Key words: chipprobing, testmap, rebirth

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